Samsung crosses LPDDR5 and UFS 3.1 in one tiny smartphone module

Samsung crosses LPDDR5 and UFS 3.1 in one tiny smartphone module

Samsung Electronics announced the start of mass production of LPDDR5 uMCP (UFS-based multichip package) memory modules, which are intended for use in smartphones of the middle and high price segments.

LPDDR5 uMCP combines fast LPDDR5 DRAM with the latest UFS 3.1 NAND flash, delivering flagship-grade performance to a much wider range of smartphone users. The manufacturer claims that the new format delivers lightning speed with very low power consumption. Such memory is useful for transferring large amounts of memory over 5G networks, when processing large photos and videos, in modern games and augmented reality applications.

Flagship-grade capabilities are made possible by a nearly 50 percent increase in RAM performance, from 17 GB / s to 25 GB / s, and a doubling of NAND flash performance from 1.5 GB / s to 3 GB / s compared to the previous solution. UFS 2.2 based on LPDDR4X.

This solution also allows efficient use of the internal volume of the smartphone by integrating DRAM and NAND storage into a single compact body measuring only 11.5 x 13 mm. The amount of RAM can be from 6 to 128 GB, and flash memory – from 128 to 512 GB.

Samsung has now successfully completed LPDDR5 uMCP compatibility testing with several global smartphone manufacturers and expects uMCP-equipped devices to hit major markets starting this month.

Samsung crosses LPDDR5 and UFS 3.1 in one tiny smartphone module

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